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BGM15LA12E6327XTSA1 Tech Specifications
Infineon BGM15LA12E6327XTSA1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
Factory Lead Time | 12 Weeks | |
Surface Mount | YES | |
Package / Case | 12-UFQFN Exposed Pad | |
Mounting Type | Surface Mount | |
Operating Temperature (Min.) | -40°C | |
Operating Temperature (Max.) | 85°C | |
Usage Level | Industrial grade | |
Published | 2015 | |
Packaging | Tape & Reel (TR) | |
JESD-609 Code | e4 | |
Pbfree Code | yes | |
Part Status | Active | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Number of Terminations | 12Terminations | |
Terminal Finish | Gold/Nickel (Au/Ni) | |
HTS Code | 8542.39.00.01 | |
Voltage - Supply | 2.2V~3.3V | |
Terminal Position | BOTTOM | |
Terminal Form | BUTT | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Number of Functions | 1Function | |
Supply Voltage | 2.8V | |
Terminal Pitch | 0.4mm | |
Frequency | 700MHz~1GHz | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
JESD-30 Code | R-XBCC-B12 | |
Temperature Grade | INDUSTRIAL | |
Test Frequency | 925MHz~960MHz | |
Current - Supply | 4.9mA | |
Halogen Free | Halogen Free | |
Gain | 17.3dB | |
Telecom IC Type | TELECOM CIRCUIT | |
RF Type | LTE, W-CDMA | |
Noise Figure | 1.1dB | |
P1dB | -8dBm | |
Width | 1.1mm | |
Height Seated (Max) | 0.65mm | |
Length | 1.9mm | |
RoHS Status | ROHS3 Compliant | |
Lead Free | Lead Free |
BGM15LA12E6327XTSA1 Documents
Download datasheets and manufacturer documentation for BGM15LA12E6327XTSA1
- DatasheetsBGM15LA12 BGM15LA12E6327XTSA1-Infineon-datasheet-62115278.pdf BGM15LA12E6327XTSA1-Infineon-datasheet-82520548.pdf
- PCN PackagingMult Dev Packing Box Chg 18/Oct/2019 Carrier Tape Size Chg 5/Apr/2016
- Other Related DocumentsPart Number Guide
- PCN Obsolescence/ EOLMult Dev EOL-REV 6/Sep/2019 Mult Dev EOL 4/Sep/2019
- Simulation ModelsInfineon-MMIC-LNA-Keysight-ADS-Design-Kit-SM-v02_00-EN Spice Model
- ConflictMineralStatementInfineon-company-51.pdf
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