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BGC100GN6E6327XTSA1 Tech Specifications

Infineon  BGC100GN6E6327XTSA1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 12 Weeks
Mounting Type Surface Mount
Package / Case 6-XFDFN
Surface Mount YES
Usage Level Industrial grade
Packaging Tape & Reel (TR)
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 6Terminations
Terminal Finish NOT SPECIFIED
Terminal Position BOTTOM
Terminal Form BUTT
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Frequency 600MHz~2.7GHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-XBCC-B6
Telecom IC Type RF AND BASEBAND CIRCUIT
RF Type Cellular, CDMA, GSM, HSPA+, LTE, TD-SCDMA, W-CDMA
RoHS Status ROHS3 Compliant
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BGC100GN6E6327XTSA1 Documents

Download datasheets and manufacturer documentation for   BGC100GN6E6327XTSA1

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