Twicea electronic parts stores,electronic components,electronic parts,electronics parts supply Twicea electronic parts stores,electronic components,electronic parts,electronics parts supply

BGB741L7ESDE6327XTSA1 Tech Specifications

Infineon  BGB741L7ESDE6327XTSA1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 8 Weeks
Contact Plating Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 6-XFDFN Exposed Pad
Number of Pins 6Pins
Usage Level Military grade
Packaging Tape & Reel (TR)
Published 2009
JESD-609 Code e4
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Terminal Finish Gold (Au)
Max Operating Temperature 150°C
Min Operating Temperature -55°C
Max Power Dissipation 120mW
Voltage - Supply 1.8V~4V
Construction COMPONENT
Frequency 50MHz~3.5GHz
Test Frequency 1.5GHz
Current - Supply 30mA
Halogen Free Halogen Free
Gain 19.5dB
RF/Microwave Device Type WIDE BAND LOW POWER
RF Type Cellular, RKE, WiFi
Input Power-Max (CW) 20dBm
Characteristic Impedance 50Ohm
Max Junction Temperature (Tj) 150°C
Noise Figure 1dB
P1dB -6.5dBm
Height 500μm
Radiation Hardening No
RoHS Status ROHS3 Compliant
Lead Free Lead Free
View Similar

BGB741L7ESDE6327XTSA1 Documents

Download datasheets and manufacturer documentation for   BGB741L7ESDE6327XTSA1

BGB741L7ESDE6327XTSA1 brand manufacturers: Infineon Technologies, Twicea stock, BGB741L7ESDE6327XTSA1 reference price.Infineon Technologies. BGB741L7ESDE6327XTSA1 parameters, BGB741L7ESDE6327XTSA1 Datasheet PDF and pin diagram description download.You can use the BGB741L7ESDE6327XTSA1 RF Amplifiers, DSP Datesheet PDF, find BGB741L7ESDE6327XTSA1 pin diagram and circuit diagram and usage method of function,BGB741L7ESDE6327XTSA1 electronics tutorials.You can download from the Twicea.