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- BGB707L7ESDE6327XTSA1
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BGB707L7ESDE6327XTSA1 Tech Specifications
Infineon BGB707L7ESDE6327XTSA1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
Factory Lead Time | 8 Weeks | |
Mounting Type | Surface Mount | |
Package / Case | 6-XFDFN Exposed Pad | |
Surface Mount | YES | |
Usage Level | Automotive grade | |
Packaging | Tape & Reel (TR) | |
Published | 2009 | |
JESD-609 Code | e4 | |
Part Status | Active | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Number of Terminations | 7Terminations | |
Terminal Finish | Gold (Au) | |
HTS Code | 8542.39.00.01 | |
Voltage - Supply | 1.8V~4V | |
Terminal Position | DUAL | |
Terminal Form | NO LEAD | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Number of Functions | 1Function | |
Supply Voltage | 3V | |
Terminal Pitch | 0.5mm | |
Frequency | 2.3GHz 2.7GHz | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
JESD-30 Code | R-PDSO-N7 | |
Test Frequency | 1.5GHz | |
Current - Supply | 25mA | |
Gain | 27dB | |
Screening Level | AEC-Q101 | |
Telecom IC Type | TELECOM CIRCUIT | |
RF Type | 802.11a/b/g/n | |
Noise Figure | 0.7dB | |
P1dB | 8dBm | |
Length | 2mm | |
Height Seated (Max) | 0.5mm | |
Width | 1.3mm | |
RoHS Status | ROHS3 Compliant |
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