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BGA825L6SE6327XTSA1 Tech Specifications
Infineon BGA825L6SE6327XTSA1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 10 Weeks | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | 6-XFDFN | |
| Number of Pins | 6Pins | |
| Usage Level | Industrial grade | |
| Packaging | Cut Tape (CT) | |
| Published | 2005 | |
| JESD-609 Code | e4 | |
| Part Status | Obsolete | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Terminal Finish | Gold (Au) | |
| Max Operating Temperature | 85°C | |
| Min Operating Temperature | -40°C | |
| Voltage - Supply | 1.5V~3.6V | |
| Frequency | 1.55GHz~1.615GHz | |
| Number of Channels | 1Channel | |
| Test Frequency | 1.575GHz | |
| Power Dissipation | 72mW | |
| Halogen Free | Halogen Free | |
| Gain | 17dB | |
| RF/Microwave Device Type | NARROW BAND LOW POWER | |
| RF Type | GPS | |
| Noise Figure | 0.6dB | |
| Continuous Collector Current | 4.8mA | |
| P1dB | -10dBm | |
| RoHS Status | RoHS Compliant | |
| Lead Free | Lead Free |
BGA825L6SE6327XTSA1 Documents
Download datasheets and manufacturer documentation for BGA825L6SE6327XTSA1
- DatasheetsBGA825L6S BGA825L6SE6327XTSA1-Infineon-datasheet-62293456.pdf
- PCN PackagingMult Dev Packing Box Chg 18/Oct/2019
- Other Related DocumentsPart Number Guide
- PCN Obsolescence/ EOLBGA825L6 EOL 25/Jun/2018 BGA825L6 LDD Rev 26/Jun/2018 BGA825L6 Rev2 9/Jul/2018
- ConflictMineralStatementInfineon-company-51.pdf
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