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BGA824N6E6327XTSA1 Tech Specifications
Infineon BGA824N6E6327XTSA1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 12 Weeks | |
| Contact Plating | Tin | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | 6-XFDFN | |
| Number of Pins | 6Pins | |
| Usage Level | Industrial grade | |
| Packaging | Tape & Reel (TR) | |
| Published | 2013 | |
| JESD-609 Code | e3 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Max Operating Temperature | 150°C | |
| Max Power Dissipation | 60mW | |
| Voltage - Supply | 1.5V~3.3V | |
| Construction | COMPONENT | |
| Frequency | 1.55GHz~1.615GHz | |
| Number of Channels | 1Channel | |
| Test Frequency | 1.55GHz~1.615GHz | |
| Operating Supply Current | 3.8mA | |
| Halogen Free | Halogen Free | |
| Gain | 17dB | |
| RF/Microwave Device Type | NARROW BAND LOW POWER | |
| RF Type | Galileo, GLONASS, GPS | |
| Characteristic Impedance | 50Ohm | |
| Max Junction Temperature (Tj) | 150°C | |
| Noise Figure | 0.55dB | |
| P1dB | -9dBm | |
| Ambient Temperature Range High | 85°C | |
| Height | 400μm | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
BGA824N6E6327XTSA1 Documents
Download datasheets and manufacturer documentation for BGA824N6E6327XTSA1
- DatasheetsBGA824N6 BGA824N6E6327XTSA1-Infineon-datasheet-62115275.pdf BGA824N6E6327XTSA1-Infineon-datasheet-82520546.pdf
- PCN PackagingMult Dev Packing Box Chg 18/Oct/2019
- Other Related DocumentsPart Number Guide
- Simulation ModelsInfineon-AN325-BGA824N6-AWR-MWO-Application-Example-SM-v01_00-EN Spice Model
- ConflictMineralStatementInfineon-company-51.pdf
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