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BGA622L7E6327XTSA1 Tech Specifications
Infineon BGA622L7E6327XTSA1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | 6-XFDFN Exposed Pad | |
| Number of Pins | 7Pins | |
| Packaging | Tape & Reel (TR) | |
| Published | 2005 | |
| JESD-609 Code | e4 | |
| Part Status | Obsolete | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Terminal Finish | Gold (Au) | |
| Max Operating Temperature | 150°C | |
| Min Operating Temperature | -65°C | |
| Max Power Dissipation | 35mW | |
| Construction | COMPONENT | |
| Frequency | 500MHz~6GHz | |
| Operating Supply Voltage | 2.75V | |
| Number of Channels | 1Channel | |
| Operating Supply Current | 10mA | |
| Power Dissipation | 35mW | |
| Halogen Free | Halogen Free | |
| Gain | 17.5dB | |
| RF/Microwave Device Type | WIDE BAND LOW POWER | |
| RF Type | 802.15/Bluetooth, ISM, WLAN, GSM, GPS, DCS, UMTS | |
| Input Power-Max (CW) | 6dBm | |
| Characteristic Impedance | 50Ohm | |
| Noise Figure | 0.95dB | |
| P1dB | -20dBm | |
| Length | 2mm | |
| Width | 1.3mm | |
| Thickness | 400μm | |
| Radiation Hardening | No | |
| RoHS Status | RoHS Compliant | |
| Lead Free | Lead Free |
BGA622L7E6327XTSA1 Documents
Download datasheets and manufacturer documentation for BGA622L7E6327XTSA1
- DatasheetsBGA622L7
- PCN PackagingRecyclable Glass Carrier 14/Oct/2014
- Other Related DocumentsPart Number Guide
- PCN Obsolescence/ EOLBGA Series EOL 12/Oct/2015
- ConflictMineralStatementInfineon-company-51.pdf
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