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BGA616H6327XTSA1 Tech Specifications

Infineon  BGA616H6327XTSA1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 6 Weeks
Contact Plating Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case SC-82A, SOT-343
Number of Pins 4Pins
Packaging Tape & Reel (TR)
Published 2005
JESD-609 Code e3
Pbfree Code yes
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Max Operating Temperature 150°C
Min Operating Temperature -65°C
Max Power Dissipation 360mW
Construction COMPONENT
Frequency 0Hz~2.7GHz
Number of Channels 1Channel
Max Supply Voltage 4.5V
Test Frequency 1GHz
Power Dissipation 360mW
Halogen Free Halogen Free
Gain 19dB
RF/Microwave Device Type WIDE BAND LOW POWER
RF Type CDMA, GSM, PCS
Characteristic Impedance 50Ohm
Noise Figure 2.5dB
P1dB 18dBm
Height 900μm
Length 2mm
Width 1.25mm
Radiation Hardening No
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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