- All Products
 - RF/IF and RFID
 - RF Amplifiers
 - BGA614H6327XTSA1
 
In Stock 
          :
          6814 Min. : 1
        Mult. : 1
 
            Not available to buy on line? Want the lower wholesale price? Please
            sendRFQ, we will
            respond immediately
          
BGA614H6327XTSA1 Tech Specifications
Infineon BGA614H6327XTSA1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 4 Weeks | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | SC-82A, SOT-343 | |
| Number of Pins | 4Pins | |
| Packaging | Tape & Reel (TR) | |
| Published | 2005 | |
| JESD-609 Code | e3 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Terminal Finish | Tin (Sn) | |
| Max Operating Temperature | 150°C | |
| Min Operating Temperature | -65°C | |
| Max Power Dissipation | 240mW | |
| Construction | COMPONENT | |
| Frequency | 0Hz~2.4GHz | |
| Number of Channels | 1Channel | |
| Max Supply Voltage | 3V | |
| Test Frequency | 1GHz | |
| Power Dissipation | 240mW | |
| Halogen Free | Halogen Free | |
| Gain | 19dB | |
| RF/Microwave Device Type | WIDE BAND LOW POWER | |
| RF Type | CDMA, GSM, PCS | |
| Characteristic Impedance | 50Ohm | |
| Noise Figure | 2.1dB | |
| P1dB | 12dBm | |
| Radiation Hardening | No | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free | 
BGA614H6327XTSA1 Documents
Download datasheets and manufacturer documentation for BGA614H6327XTSA1
- DatasheetsBGA614
 - PCN PackagingRecyclable Glass Carrier 14/Oct/2014 Reel Cover Tape Chg 16/Feb/2016
 - Other Related DocumentsPart Number Guide
 - Simulation ModelsInfineon-MMIC-LNA-AWR-MWO-Design-Kit-SM-v02_00-EN Spice Model
 - ConflictMineralStatementInfineon-company-51.pdf
 
Index :
 0123456789ABCDEFGHIJKLMNOPQRSTUVWXYZ
 
 
 
 
 
 
 
 
 