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BGA427H6327XTSA1 Tech Specifications
Infineon BGA427H6327XTSA1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 6 Weeks | |
| Contact Plating | Tin | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | SC-82A, SOT-343 | |
| Number of Pins | 4Pins | |
| Packaging | Tape & Reel (TR) | |
| Published | 2005 | |
| JESD-609 Code | e3 | |
| Part Status | Not For New Designs | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Max Operating Temperature | 150°C | |
| Min Operating Temperature | -65°C | |
| Max Power Dissipation | 150mW | |
| Voltage - Supply | 2V~5V | |
| Construction | COMPONENT | |
| Frequency | 0Hz~3GHz | |
| Operating Supply Voltage | 3V | |
| Number of Channels | 1Channel | |
| Test Frequency | 1.8GHz | |
| Operating Supply Current | 25mA | |
| Nominal Supply Current | 25mA | |
| Power Dissipation | 150mW | |
| Halogen Free | Halogen Free | |
| Gain | 18.5dB | |
| RF/Microwave Device Type | NARROW BAND MEDIUM POWER | |
| RF Type | General Purpose | |
| Characteristic Impedance | 50Ohm | |
| Noise Figure | 2.2dB | |
| Radiation Hardening | No | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
BGA427H6327XTSA1 Documents
Download datasheets and manufacturer documentation for BGA427H6327XTSA1
- DatasheetsBGA427
- PCN PackagingRecyclable Glass Carrier 14/Oct/2014 Reel Cover Tape Chg 16/Feb/2016
- Other Related DocumentsPart Number Guide
- Simulation ModelsInfineon-MMIC-LNA-AWR-MWO-Design-Kit-SM-v02_00-EN Spice Model
- ConflictMineralStatementInfineon-company-51.pdf
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