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BB844E6327HTSA1 Tech Specifications

Infineon  BB844E6327HTSA1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 4 Weeks
Contact Plating Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case TO-236-3, SC-59, SOT-23-3
Number of Pins 3Pins
Diode Element Material SILICON
Number of Elements 1 Element
Operating Temperature -55°C~150°C TJ
Packaging Tape & Reel (TR)
Published 2005
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 3Terminations
ECCN Code EAR99
Additional Feature CAPACITANCE MATCHED TO 1.5 %
HTS Code 8541.10.00.80
Capacitance 42.5pF
Voltage - Rated DC 18V
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Element Configuration Single
Diode Type 1 Pair Common Cathode
Forward Current 50mA
Capacitance @ Vr, F 13pF @ 8V 1MHz
Frequency Band VERY HIGH FREQUENCY
Diode Capacitance-Nom 43.75pF
Capacitance Ratio 3.8
Capacitance Ratio Condition C2/C8
Diode Cap Tolerance 2.86%
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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