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BB814E6327GR1HTSA1 Tech Specifications

Infineon  BB814E6327GR1HTSA1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 4 Weeks
Contact Plating Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case TO-236-3, SC-59, SOT-23-3
Number of Pins 3Pins
Operating Temperature -55°C~125°C TJ
Packaging Tape & Reel (TR)
Published 2005
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN Code EAR99
Capacitance 46.5pF
Voltage - Rated DC 18V
Base Part Number BB814
Element Configuration Dual
Diode Type 1 Pair Common Cathode
Forward Current 50mA
Capacitance @ Vr, F 22.7pF @ 8V 1MHz
Capacitance Ratio 2.25
Capacitance Ratio Condition C2/C8
Q @ Vr, F 200 @ 2V, 100MHz
Radiation Hardening No
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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BB814E6327GR1HTSA1 Documents

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