BAS70E6327HTSA1 Tech Specifications

Infineon  BAS70E6327HTSA1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 4 Weeks
Contact Plating Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case TO-236-3, SC-59, SOT-23-3
Number of Pins 3Pins
Diode Element Material SILICON
Number of Elements 1 Element
Power Dissipation (Max) 0.25W
Packaging Tape & Reel (TR)
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 3Terminations
ECCN Code EAR99
Max Operating Temperature 125°C
Min Operating Temperature -55°C
HTS Code 8541.10.00.60
Voltage - Rated DC 70V
Terminal Position DUAL
Terminal Form GULL WING
Current Rating 70mA
Base Part Number BAS70
Pin Count 3
Element Configuration Single
Speed Small Signal =< 200mA (Io), Any Speed
Diode Type Schottky
Current - Reverse Leakage @ Vr 100nA @ 50V
Voltage - Forward (Vf) (Max) @ If 1V @ 15mA
Forward Current 70mA
Operating Temperature - Junction -55°C~125°C
Halogen Free Not Halogen Free
Current - Average Rectified (Io) 70mA DC
Forward Voltage 1V
Reverse Recovery Time 100 ps
Max Repetitive Reverse Voltage (Vrrm) 70V
Capacitance @ Vr, F 2pF @ 0V 1MHz
Peak Non-Repetitive Surge Current 100mA
Diode Capacitance-Max 2pF
Radiation Hardening No
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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