BAS4006E6327HTSA1 Tech Specifications

Infineon  BAS4006E6327HTSA1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 4 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case TO-236-3, SC-59, SOT-23-3
Number of Pins 3Pins
Diode Element Material SILICON
Number of Elements 2 Elements
Power Dissipation (Max) 0.25W
Packaging Tape & Reel (TR)
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 3Terminations
ECCN Code EAR99
Terminal Finish Tin (Sn)
Max Operating Temperature 150°C
Min Operating Temperature -55°C
HTS Code 8541.10.00.70
Terminal Position DUAL
Terminal Form GULL WING
Base Part Number BAS40-06
Reference Standard AEC-Q101
Element Configuration Common Anode
Speed Small Signal =< 200mA (Io), Any Speed
Diode Type Schottky
Current - Reverse Leakage @ Vr 1μA @ 30V
Voltage - Forward (Vf) (Max) @ If 1V @ 40mA
Forward Current 120mA
Operating Temperature - Junction 150°C Max
Output Current-Max 0.12A
Halogen Free Not Halogen Free
Current - Average Rectified (Io) 120mA DC
Forward Voltage 1V
Max Reverse Voltage (DC) 40V
Average Rectified Current 120mA
Reverse Recovery Time 100 ps
Max Repetitive Reverse Voltage (Vrrm) 40V
Peak Non-Repetitive Surge Current 200mA
Diode Configuration 1 Pair Common Anode
Radiation Hardening No
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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