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BAS4004E6327HTSA1 Tech Specifications

Infineon  BAS4004E6327HTSA1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 4 Weeks
Package / Case TO-236-3, SC-59, SOT-23-3
Mounting Type Surface Mount
Mount Surface Mount
Number of Pins 3Pins
Diode Element Material SILICON
Power Dissipation (Max) 0.25W
Number of Elements 2 Elements
Packaging Tape & Reel (TR)
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 3Terminations
Termination SMD/SMT
ECCN Code EAR99
Terminal Finish Tin (Sn)
Max Operating Temperature 125°C
Min Operating Temperature -55°C
HTS Code 8541.10.00.70
Terminal Form GULL WING
Base Part Number BAS40-04
Pin Count 3
Reference Standard AEC-Q101
Element Configuration Dual
Speed Small Signal =< 200mA (Io), Any Speed
Diode Type Schottky
Current - Reverse Leakage @ Vr 1μA @ 30V
Voltage - Forward (Vf) (Max) @ If 1V @ 40mA
Forward Current 120mA
Max Reverse Leakage Current 1μA
Operating Temperature - Junction 150°C Max
Max Surge Current 200mA
Output Current-Max 0.12A
Halogen Free Not Halogen Free
Current - Average Rectified (Io) 120mA DC
Forward Voltage 380mV
Max Reverse Voltage (DC) 40V
Average Rectified Current 120mA
Reverse Recovery Time 100 ps
Peak Reverse Current 1μA
Max Repetitive Reverse Voltage (Vrrm) 40V
Peak Non-Repetitive Surge Current 200mA
Diode Configuration 1 Pair Series Connection
Max Forward Surge Current (Ifsm) 200mA
Recovery Time 100 ps
Width 1.3mm
Length 2.9mm
Height 900μm
RoHS Status ROHS3 Compliant
Radiation Hardening No
REACH SVHC No SVHC
Lead Free Lead Free
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