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BAS28E6327HTSA1 Tech Specifications

Infineon  BAS28E6327HTSA1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 4 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case TO-253-4, TO-253AA
Number of Pins 4Pins
Diode Element Material SILICON
Number of Elements 2 Elements
Power Dissipation (Max) 0.33W
Packaging Tape & Reel (TR)
Published 2007
JESD-609 Code e3
Pbfree Code yes
Part Status Last Time Buy
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 4Terminations
ECCN Code EAR99
Terminal Finish Tin (Sn)
Max Operating Temperature 150°C
Min Operating Temperature -55°C
Voltage - Rated DC 80V
Terminal Form GULL WING
Current Rating 200mA
Base Part Number BAS28
Pin Count 4
Element Configuration Dual
Speed Small Signal =< 200mA (Io), Any Speed
Diode Type Standard
Current - Reverse Leakage @ Vr 100nA @ 75V
Voltage - Forward (Vf) (Max) @ If 1.25V @ 150mA
Forward Current 200mA
Operating Temperature - Junction 150°C Max
Output Current-Max 0.2A
Halogen Free Not Halogen Free
Current - Average Rectified (Io) 200mA DC
Forward Voltage 1.25V
Max Reverse Voltage (DC) 80V
Average Rectified Current 200mA
Reverse Recovery Time 4 ns
Max Repetitive Reverse Voltage (Vrrm) 85V
Peak Non-Repetitive Surge Current 4.5A
Diode Configuration 2 Independent
Reverse Current-Max 50μA
Reverse Test Voltage 75V
Radiation Hardening No
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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