BAS16SH6327XTSA1 Tech Specifications

Infineon  BAS16SH6327XTSA1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 4 Weeks
Contact Plating Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 6-VSSOP, SC-88, SOT-363
Number of Pins 6Pins
Diode Element Material SILICON
Number of Elements 3 Elements
Power Dissipation (Max) 0.25W
Packaging Tape & Reel (TR)
JESD-609 Code e3
Pbfree Code yes
Part Status Last Time Buy
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 6Terminations
ECCN Code EAR99
Max Operating Temperature 150°C
Min Operating Temperature -65°C
HTS Code 8541.10.00.70
Terminal Position DUAL
Terminal Form GULL WING
Base Part Number BAS16S
Pin Count 6
Speed Small Signal =< 200mA (Io), Any Speed
Diode Type Standard
Current - Reverse Leakage @ Vr 1μA @ 75V
Voltage - Forward (Vf) (Max) @ If 1.25V @ 150mA
Forward Current 200mA
Operating Temperature - Junction 150°C Max
Output Current-Max 0.2A
Halogen Free Halogen Free
Current - Average Rectified (Io) 200mA DC
Forward Voltage 1.25V
Max Reverse Voltage (DC) 80V
Average Rectified Current 200mA
Reverse Recovery Time 4 ns
Max Repetitive Reverse Voltage (Vrrm) 85V
Peak Non-Repetitive Surge Current 4.5A
Diode Configuration 3 Independent
Height 800μm
Length 2mm
Width 1.25mm
Radiation Hardening No
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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