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- ESD3V3S1B-02LSE6327
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ESD3V3S1B-02LSE6327 Tech Specifications
Infineon ESD3V3S1B-02LSE6327 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Mounting Type | Surface Mount | |
| Package / Case | 0201 (0603 Metric) | |
| Supplier Device Package | PG-TSSLP-2-1 | |
| Number of Elements per Chip | 1 | |
| Supplier Package | TSSLP | |
| Direction Type | Bi-Directional | |
| ESD Protection Voltage | ±30@Contact Disc kV | |
| Mounting | Surface Mount | |
| Package | Bulk | |
| Mfr | Infineon Technologies | |
| Product Status | Active | |
| Operating Temperature | -40°C ~ 125°C (TA) | |
| Series | - | |
| Type | TVS | |
| Applications | General Purpose | |
| Capacitance | 20 pF | |
| Pin Count | 2 | |
| Configuration | Single | |
| Power Line Protection | No | |
| Voltage - Breakdown (Min) | - | |
| Power - Peak Pulse | - | |
| Current - Peak Pulse (10/1000μs) | 8A (8/20µs) | |
| Voltage - Clamping (Max) @ Ipp | 6.8V (Typ) | |
| Voltage - Reverse Standoff (Typ) | 3.3V (Max) | |
| Bidirectional Channels | 1 | |
| Capacitance @ Frequency | 14pF @ 1MHz |
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