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- BGM1143N9E6327XUSA1
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BGM1143N9E6327XUSA1 Tech Specifications
Infineon BGM1143N9E6327XUSA1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| EU RoHS | Compliant | |
| Automotive | No | |
| PPAP | No | |
| Mounting | Surface Mount | |
| Package Height | 0.75(Max) | |
| Package Width | 1.1 | |
| Package Length | 1.5 | |
| PCB changed | 9 | |
| Standard Package Name | TSNP | |
| Supplier Package | TSNP | |
| Category | Front-End Module | |
| Manufacturer Part Number | BGM1143N9E6327XUSA1 | |
| Manufacturer | Infineon Technologies AG | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Risk Rank | 5.66 | |
| Usage Level | Industrial grade | |
| Operating Temperature | -40 to 85 °C | |
| Part Status | Unconfirmed | |
| HTS Code | 8542.39.00.01 | |
| Reach Compliance Code | compliant | |
| Pin Count | 9 | |
| Screening Level | Industrial | |
| Telecom IC Type | RF AND BASEBAND CIRCUIT |
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