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BS812C-1 Tech Specifications

Holtek  BS812C-1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Contact plating gold-plated
Surface Mount YES
Number of pins 70pins
Number of Terminals 6Terminals
Type of connector pin strips
Connector socket
Kind of connector female
Spatial orientation straight
Contacts pitch 2.54mm
Electrical mounting THT
Connector pinout layout 2x35
Row pitch 2.54mm
Gross weight 3.79 g
Part Life Cycle Code Active
Ihs Manufacturer HOLTEK SEMICONDUCTOR INC
Package Description LSSOP, TSOP6,.11,37
Date Of Intro 2019-10-25
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code LSSOP
Package Equivalence Code TSOP6,.11,37
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Supply Voltage-Nom (Vsup) 3 V
Operating temperature -40...163°C
HTS Code 8542.39.00.01
Terminal Position DUAL
Terminal Form GULL WING
Number of Functions 1Function
Terminal Pitch 0.95 mm
Reach Compliance Code compliant
Current rating 1.5A
JESD-30 Code R-PDSO-G6
Supply Voltage-Max (Vsup) 5.5 V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 2.2 V
Number of Channels 1Channel
Analog IC - Other Type ANALOG CIRCUIT
Seated Height-Max 1.45 mm
Rated voltage 60V
Profile beryllium copper
Length 2.9 mm
Width 1.6 mm
Plating thickness 0.75µm
Flammability rating UL94V-0
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BS812C-1 Documents

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