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H8504-01 Tech Specifications

Harwin  H8504-01 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 9 Weeks
Contact Plating Gold, Tin
Mount Through Hole
Material Brass
Mounting Hole Diameter 0.075 ~ 0.079 (1.91mm ~ 2.01mm)
Contact Materials Beryllium Copper
Operating Temperature -55°C~125°C
Packaging Bulk
Published 2010
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Connector Type Connector, Socket
HTS Code 8536.90.40.00
Contact Finish Gold
Plating Tin
Hole Diameter 2.0066 mm
Flange Diameter 0.093 (2.36mm)
Outside Diameter 2.35 mm
Tail Type No Tail
Accepts Pin Diameter 0.024 ~ 0.033 (0.60mm ~ 0.85mm)
Socket Depth 0.183 4.65mm
Insertion Force 1.50N ~ 5.01N
Length 5.6896mm
Contact Finish Thickness 5.90μin 0.150μm
Length - Overall 0.224 5.69mm
RoHS Status ROHS3 Compliant
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H8504-01 Documents

Download datasheets and manufacturer documentation for   H8504-01

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