H3185-05 Tech Specifications

Harwin  H3185-05 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 9 Weeks
Weight 124.000814mg
Mounting Hole Diameter 0.086 ~ 0.090 (2.18mm ~ 2.29mm)
Contact Materials Beryllium Copper
Published 2009
Packaging Bulk
Operating Temperature -55°C~125°C
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Connector Type Connector, PCB, Socket
HTS Code 8536.69.40.40
Current Rating 10A
Contact Finish Gold
Number of Contacts 1Contact
Hole Diameter 2.286 mm
Flange Diameter 0.125 (3.18mm)
Tail Type No Tail
Accepts Pin Diameter 0.035 ~ 0.041 (0.89mm ~ 1.05mm)
Socket Depth 0.140 3.56mm
Insertion Force 3.00N ~ 9.00N
Length 5.9944mm
Contact Finish Thickness 5.90μin 0.150μm
Length - Overall 0.236 6.00mm
RoHS Status ROHS3 Compliant
Radiation Hardening No
REACH SVHC No SVHC
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H3185-05 Documents

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