H3165-01 Tech Specifications

Harwin  H3165-01 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 9 Weeks
Material Brass
Mounting Hole Diameter 0.075 ~ 0.077 (1.91mm ~ 1.96mm)
Contact Materials Beryllium Copper
Operating Temperature -55°C~125°C
Packaging Bulk
Published 2011
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Press-Fit, Knurled
ECCN Code EAR99
Connector Type Connector, PCB, Socket
HTS Code 8536.90.40.00
Orientation Straight
Depth 2.67mm
Current Rating 10A
Contact Finish Gold
Number of Contacts 1Contact
Contact Resistance 25mOhm
Plating Tin
Terminal and Terminal Block Type PCB TERMINAL
Hole Diameter 1.96 mm
Flange Diameter 0.105 (2.67mm)
Outside Diameter 2.67 mm
Tail Type No Tail
Accepts Pin Diameter 0.035 ~ 0.041 (0.89mm ~ 1.05mm)
Socket Depth 0.187 4.75mm
Insertion Force 3.00N ~ 9.00N
Length 5.6388mm
Contact Finish Thickness 5.90μin 0.150μm
Length - Overall 0.222 5.65mm
REACH SVHC No SVHC
Radiation Hardening No
RoHS Status ROHS3 Compliant
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H3165-01 Documents

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