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H2183-05 Tech Specifications
Harwin H2183-05 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Contact Plating | Gold | |
| Mounting Type | Through Hole | |
| Material - Insulation | - | |
| Mounting Hole Diameter | 0.071 ~ 0.075 (1.80mm ~ 1.90mm) | |
| RoHS | Details | |
| Contact Materials | Brass | |
| Maximum Bundle Diameter | 1.75 mm | |
| Maximum Operating Temperature | + 105 C | |
| Minimum Operating Temperature | - 40 C | |
| Factory Pack QuantityFactory Pack Quantity | 1000 | |
| Mounting Hole Dia | 1.9mm | |
| Package | Bag | |
| Base Product Number | H2183 | |
| Length Below Flange | 0.077 (1.95mm) | |
| Mfr | Harwin Inc. | |
| Product Status | Active | |
| Length Above Flange | 0.374 (9.50mm) | |
| Series | - | |
| Termination | Swage | |
| Gender | Male | |
| Insulation Color | - | |
| Contact Finish | Gold | |
| Insulation | Non-Insulated | |
| Terminal Type | PC Pin | |
| Flange Diameter | 0.089 (2.25mm) | |
| Terminal Style | Single End | |
| Pin Size - Above Flange | 0.070 (1.78mm) Dia | |
| Pin Size - Below Flange | 0.070 (1.78mm) Dia | |
| Product | Wire to Board Terminals | |
| Mounting Angle | Vertical | |
| Length | 11.85 mm | |
| Contact Finish Thickness | - | |
| Length - Overall | 0.467 (11.86mm) | |
| Board Thickness | 0.063 (1.60mm) |
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