Harris Semiconductor HM6-6616-8 Memory Modules
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HM6-6616-8 Tech Specifications
HARRIS HM6-6616-8 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Surface Mount | NO | |
| Number of Terminals | 24Terminals | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | HARRIS SEMICONDUCTOR | |
| Package Description | DIP, DIP24,.3 | |
| Access Time-Max | 140 ns | |
| Number of Words | 2048 wordsWord | |
| Number of Words Code | 2000Words Codes | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Body Material | CERAMIC | |
| Package Code | DIP | |
| Package Equivalence Code | DIP24,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| JESD-609 Code | e0 | |
| ECCN Code | EAR99 | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| HTS Code | 8542.32.00.71 | |
| Terminal Position | DUAL | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Reach Compliance Code | unknown | |
| JESD-30 Code | R-XDIP-T24 | |
| Qualification Status | Not Qualified | |
| Temperature Grade | MILITARY | |
| Supply Current-Max | 0.046 mA | |
| Organization | 2KX8 | |
| Memory Width | 8 | |
| Standby Current-Max | 0.0001 A | |
| Memory Density | 16384 bit | |
| Screening Level | MIL-STD-883 Class B (Modified) | |
| Memory IC Type | OTP ROM |
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