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GB02SHT06-46 Tech Specifications

GeneSiC Semiconductor  GB02SHT06-46 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 18 Weeks
Mount Through Hole
Mounting Type Through Hole
Package / Case TO-206AB, TO-46-3 Metal Can
Number of Pins 3Pins
Number of Elements 1 Element
Operating Temperature (Max.) 210°C
Power Dissipation (Max) 64W
Packaging Bulk
Published 2014
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2Terminations
Applications EFFICIENCY
Additional Feature PD-CASE
Terminal Position BOTTOM
Terminal Form WIRE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code O-MBCY-W2
Configuration SINGLE
Speed No Recovery Time > 500mA (Io)
Diode Type Silicon Carbide Schottky
Current - Reverse Leakage @ Vr 5μA @ 600V
Voltage - Forward (Vf) (Max) @ If 1.6V @ 1A
Operating Temperature - Junction -55°C~225°C
Output Current-Max 4A
Current - Average Rectified (Io) 4A DC
Max Reverse Voltage (DC) 600V
Average Rectified Current 4A
Number of Phases 1Phase
Reverse Recovery Time 0ns
Capacitance @ Vr, F 76pF @ 1V 1MHz
Non-rep Pk Forward Current-Max 10A
Reverse Current-Max 5μA
RoHS Status RoHS Compliant
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GB02SHT06-46 Documents

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