General Electric SB625
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Mult. : 1
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SB625 Tech Specifications
General Electric SB625 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Mounting Type | Through Hole | |
| Material - Insulation | Thermoplastic, Glass Filled | |
| Lead Free Status / RoHS Status | -- | |
| Contact Materials | Copper Alloy | |
| RoHS | Non-Compliant | |
| Operating Temperature | -55°C ~ 125°C | |
| Series | Cantilever | |
| Packaging | Bulk | |
| Part Status | Obsolete | |
| Moisture Sensitivity Level (MSL) | -- | |
| Termination | Solder | |
| Number of Positions | 86Positions | |
| Color | Black | |
| Number of Rows | 2Rows | |
| Gender | Female | |
| Contact Type | Cantilever | |
| Pitch | 0.156 (3.96mm) | |
| Contact Finish | Gold | |
| Card Type | Non Specified - Dual Edge | |
| Read Out | Dual | |
| Number of Positions/Bay/Row | -- | |
| Flange Feature | Top Mount Opening, Unthreaded, 0.125 (3.18mm) Dia | |
| Features | -- | |
| Contact Finish Thickness | 30.0µin (0.76µm) | |
| Card Thickness | 0.054 ~ 0.071 (1.37mm ~ 1.80mm) |
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