In Stock Min. : 1
Mult. : 1
Not available to buy on line? Want the lower wholesale price? Please
sendRFQ, we will
respond immediately
XPC8245LZU266B Tech Specifications
Freescale XPC8245LZU266B technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Surface Mount | YES | |
| Number of Terminals | 352Terminals | |
| EU RoHS | Not Compliant | |
| Automotive | No | |
| PPAP | No | |
| Family Name | PowerPC MPC82xx Processor | |
| Instruction Set Architecture | RISC | |
| Number of CPU Cores | 1CPU Core | |
| Data Bus Width (bit) | 32 | |
| Instruction Cache Size | 16KB | |
| Maximum Speed (MHz) | 266 | |
| Interface Type | I2C/UART | |
| UART | 2 | |
| USART | 0 | |
| Data Cache Size | 16KB | |
| Multiply Accumulate | No | |
| I2C | 1 | |
| I2S | 0 | |
| Minimum Operating Supply Voltage (V) | 1.7|3.135 | |
| Typical Operating Supply Voltage (V) | 1.8|1.9|2|3.3 | |
| Maximum Operating Supply Voltage (V) | 2.1|3.465 | |
| I/O Voltage (V) | 3.3 | |
| Minimum Operating Temperature (°C) | 0 | |
| Maximum Operating Temperature (°C) | 105 | |
| Mounting | Surface Mount | |
| Package Height | 1.05(Max) | |
| Package Width | 35 | |
| Package Length | 35 | |
| PCB changed | 352 | |
| Standard Package Name | BGA | |
| Supplier Package | TBGA | |
| Lead Shape | Ball | |
| Package Description | LBGA, BGA352,26X26,50 | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Moisture Sensitivity Levels | 3 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Equivalence Code | BGA352,26X26,50 | |
| Supply Voltage-Nom | 1.8 V | |
| Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Supply Voltage-Min | 1.7 V | |
| Rohs Code | No | |
| Manufacturer Part Number | XPC8245LZU266B | |
| Clock Frequency-Max | 66 MHz | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Manufacturer | Motorola Mobility LLC | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MOTOROLA INC | |
| Supply Voltage-Max | 1.9 V | |
| Risk Rank | 5.31 | |
| Part Package Code | BGA | |
| Part Status | Obsolete | |
| ECCN Code | 3A001.A.3 | |
| Additional Feature | ALSO OPERATES AT 2V SUPPLY | |
| HTS Code | 8542.31.00.01 | |
| Subcategory | Microprocessors | |
| Technology | CMOS | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Terminal Pitch | 1.27 mm | |
| Reach Compliance Code | unknown | |
| Pin Count | 352 | |
| JESD-30 Code | S-PBGA-B352 | |
| Qualification Status | Not Qualified | |
| Power Supplies | 2,3.3 V | |
| Speed | 266 MHz | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC | |
| Bit Size | 32 | |
| Seated Height-Max | 1.65 mm | |
| Address Bus Width | 32 | |
| Core Architecture | 603e | |
| Boundary Scan | YES | |
| Low Power Mode | YES | |
| External Data Bus Width | 32 | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| Ethernet | 0 | |
| USB | 0 | |
| SPI | 0 | |
| CAN | 0 | |
| Device Core | MPC603e | |
| Width | 35 mm | |
| Length | 35 mm |
Index :
0123456789ABCDEFGHIJKLMNOPQRSTUVWXYZ



