FDMS016G-CAG Tech Specifications

FLEx  FDMS016G-CAG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Package / Case Axial
Surface Mount YES
Supplier Device Package Axial
Number of Terminals 9Terminals
Package Style UNCASED CHIP
Number of Words Code 16G
Package Body Material UNSPECIFIED
Operating Temperature-Min -25
Operating Temperature-Max 85
Number of Words 17179869184Words
Package Code DIE
Package Shape RECTANGULAR
Risk Rank 5.76
Ihs Manufacturer FLEXXON GLOBAL LTD
Part Life Cycle Code Contact Manufacturer
Manufacturer Flexxon Pte Ltd
Manufacturer Part Number FDMS016G-CAG
Package Description CARD-9
Operating Temperature -55°C ~ 150°C
Series RNX
Packaging Bulk
Size / Dimension 0.140 Dia x 0.290 L (3.56mm x 7.37mm)
Tolerance ±1%
Part Status Active
Number of Terminations 2Terminations
Temperature Coefficient ±100ppm/°C
Type NOR TYPE
Resistance 7.5 MOhms
Composition Metal Oxide Film
Power (Watts) 0.5W, 1/2W
Technology CMOS
Terminal Position UPPER
Terminal Form NO LEAD
Number of Functions 1Function
Reach Compliance Code unknown
JESD-30 Code R-XUUC-N9
Failure Rate --
Supply Voltage-Max (Vsup) 3.6
Temperature Grade OTHER
Supply Voltage-Min (Vsup) 2.7
Operating Mode ASYNCHRONOUS
Organization 16GX8
Memory Width 8
Memory Density 1.3743895347e+11
Parallel/Serial SERIAL
Memory IC Type FLASH CARD
Programming Voltage 2.7
Features Flame Retardant Coating, High Voltage, Safety
Height Seated (Max) --
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