FDMS008G-CAC Tech Specifications

FLEx  FDMS008G-CAC technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Package / Case Axial
Surface Mount YES
Supplier Device Package Axial
Number of Terminals 9Terminals
Package Style UNCASED CHIP
Number of Words Code 8G
Package Body Material UNSPECIFIED
Operating Temperature-Min 0
Operating Temperature-Max 70
Number of Words 8589934592Words
Package Code DIE
Package Shape RECTANGULAR
Package Description CARD-9
Manufacturer Part Number FDMS008G-CAC
Manufacturer Flexxon Pte Ltd
Risk Rank 5.77
Ihs Manufacturer FLEXXON GLOBAL LTD
Part Life Cycle Code Contact Manufacturer
Operating Temperature -65°C ~ 150°C
Series Military, MIL-PRF-39017/03, RLR32
Packaging Tape & Reel (TR)
Size / Dimension 0.190 Dia x 0.562 L (4.83mm x 14.27mm)
Tolerance ±2%
Part Status Active
Number of Terminations 2Terminations
Temperature Coefficient ±100ppm/°C
Type NOR TYPE
Resistance 120 Ohms
Composition Metal Film
Power (Watts) 1W
Technology CMOS
Terminal Position UPPER
Terminal Form NO LEAD
Number of Functions 1Function
Reach Compliance Code unknown
JESD-30 Code R-XUUC-N9
Failure Rate P (0.1%)
Supply Voltage-Max (Vsup) 3.6
Temperature Grade COMMERCIAL
Supply Voltage-Min (Vsup) 2.7
Operating Mode ASYNCHRONOUS
Organization 8GX8
Memory Width 8
Memory Density 68719476736
Parallel/Serial SERIAL
Memory IC Type FLASH CARD
Programming Voltage 2.7
Features Military, Moisture Resistant, Weldable
Height Seated (Max) --
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