XLS93LC66P-3 Tech Specifications

Micro Crystal  XLS93LC66P-3 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount NO
Number of Terminals 8Terminals
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer EXEL MICROELECTRONICS INC
Package Description DIP, DIP8,.3
Number of Words 256 wordsWord
Number of Words Code 256Words Codes
Operating Temperature-Max 70 °C
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP8,.3
Package Shape RECTANGULAR
Package Style IN-LINE
JESD-609 Code e0
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.32.00.51
Terminal Position DUAL
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Reach Compliance Code unknown
JESD-30 Code R-PDIP-T8
Qualification Status Not Qualified
Temperature Grade COMMERCIAL
Supply Current-Max 0.002 mA
Organization 256X16
Memory Width 16
Standby Current-Max 0.000002 A
Memory Density 4096 bit
Parallel/Serial SERIAL
Memory IC Type EEPROM
Serial Bus Type MICROWIRE
Endurance 100000 Write/Erase Cycles
Data Retention Time-Min 10
Write Protection SOFTWARE
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XLS93LC66P-3 Documents

Download datasheets and manufacturer documentation for   XLS93LC66P-3

  • Datasheets
XLS93LC66P-3 brand manufacturers: Exel Microelectronics Inc, Twicea stock, XLS93LC66P-3 reference price.Exel Microelectronics Inc. XLS93LC66P-3 parameters, XLS93LC66P-3 Datasheet PDF and pin diagram description download.You can use the XLS93LC66P-3 Memory, DSP Datesheet PDF, find XLS93LC66P-3 pin diagram and circuit diagram and usage method of function,XLS93LC66P-3 electronics tutorials.You can download from the Twicea.