S1C17W22F00B100 Tech Specifications

Epson  S1C17W22F00B100 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Package / Case 128-TQFP
Number of I/Os 41I/Os
Operating Temperature -40°C~85°C TA
Packaging Tray
Published 2013
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Oscillator Type Internal
Speed 4.2MHz
RAM Size 4K x 8
Voltage - Supply (Vcc/Vdd) 1.2V~3.6V
Core Processor S1C17
Peripherals LCD, PWM, RFC, WDT
Program Memory Type FLASH
Core Size 16-Bit
Program Memory Size 64KB 64K x 8
Connectivity I2C, IrDA, SPI, UART/USART
View Similar

S1C17W22F00B100 Documents

Download datasheets and manufacturer documentation for   S1C17W22F00B100

S1C17W22F00B100 brand manufacturers: Epson Electronics America Inc-Semiconductor Div, Twicea stock, S1C17W22F00B100 reference price.Epson Electronics America Inc-Semiconductor Div. S1C17W22F00B100 parameters, S1C17W22F00B100 Datasheet PDF and pin diagram description download.You can use the S1C17W22F00B100 Embedded - Microcontrollers, DSP Datesheet PDF, find S1C17W22F00B100 pin diagram and circuit diagram and usage method of function,S1C17W22F00B100 electronics tutorials.You can download from the Twicea.