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S1C17W22D101100 Tech Specifications

Epson  S1C17W22D101100 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 22 Weeks
Mounting Type Surface Mount
Package / Case Die
Supplier Device Package Die
Memory Types FLASH
Number of I/Os 41I/Os
Operating Temperature -40°C~85°C TA
Packaging Tray
Published 2013
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Frequency 4.2MHz
Interface I2C, IrDA, SPI, UART, USART
Memory Size 64kB
Oscillator Type Internal
Speed 4.2MHz
RAM Size 4K x 8
Voltage - Supply (Vcc/Vdd) 1.2V~3.6V
Core Processor S1C17
Peripherals LCD, PWM, RFC, WDT
Program Memory Type FLASH
Core Size 16-Bit
Program Memory Size 64KB 64K x 8
Connectivity I2C, IrDA, SPI, UART/USART
RoHS Status RoHS Compliant
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