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S1C17W22D00B000 Tech Specifications

Epson  S1C17W22D00B000 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Package / Case Die
Number of I/Os 41I/Os
Operating Temperature -40°C~85°C TA
Packaging Tape & Reel (TR)
Published 2013
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Oscillator Type Internal
Speed 4.2MHz
RAM Size 4K x 8
Voltage - Supply (Vcc/Vdd) 1.2V~3.6V
Core Processor S1C17
Peripherals LCD, PWM, RFC, WDT
Program Memory Type FLASH
Core Size 16-Bit
Program Memory Size 64KB 64K x 8
Connectivity I2C, IrDA, SPI, UART/USART
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S1C17W22D00B000 Documents

Download datasheets and manufacturer documentation for   S1C17W22D00B000

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