S1C17F57F401100 Tech Specifications

Epson  S1C17F57F401100 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 14 Weeks
Mounting Type Surface Mount
Package / Case 128-LQFP
Number of I/Os 29I/Os
Operating Temperature -40°C~85°C TA
Packaging Tray
Published 2012
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Oscillator Type Internal
Speed 4.2MHz
RAM Size 2K x 8
Voltage - Supply (Vcc/Vdd) 2V~3.6V
Core Processor S1C17
Peripherals PWM, WDT
Program Memory Type FLASH
Core Size 16-Bit
Program Memory Size 32KB 32K x 8
Connectivity I2C, IrDA, SPI, UART/USART
RoHS Status RoHS Compliant
View Similar

S1C17F57F401100 Documents

Download datasheets and manufacturer documentation for   S1C17F57F401100

S1C17F57F401100 brand manufacturers: Epson Electronics America Inc-Semiconductor Div, Twicea stock, S1C17F57F401100 reference price.Epson Electronics America Inc-Semiconductor Div. S1C17F57F401100 parameters, S1C17F57F401100 Datasheet PDF and pin diagram description download.You can use the S1C17F57F401100 Embedded - Microcontrollers, DSP Datesheet PDF, find S1C17F57F401100 pin diagram and circuit diagram and usage method of function,S1C17F57F401100 electronics tutorials.You can download from the Twicea.