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S1C17602F101100 Tech Specifications

Epson  S1C17602F101100 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 20 Weeks
Mounting Type Surface Mount
Package / Case 100-TQFP
Data Converters A/D 8x10b
Memory Types FLASH
Number of I/Os 36I/Os
Operating Temperature -25°C~70°C TA
Packaging Tray
Published 2010
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 70°C
Min Operating Temperature -25°C
Frequency 8.2MHz
Interface I2C, IrDA, SPI, UART, USART
Memory Size 64kB
Oscillator Type Internal
Speed 8.2MHz
RAM Size 4K x 8
Voltage - Supply (Vcc/Vdd) 1.8V~3.6V
Core Processor S1C17
Peripherals LCD, PWM, WDT
Program Memory Type FLASH
Core Size 16-Bit
Program Memory Size 64KB 64K x 8
Connectivity I2C, IrDA, SPI, UART/USART
Data Bus Width 16b
RoHS Status RoHS Compliant
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