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RX8130CE Tech Specifications

Epson  RX8130CE technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Material aluminium
Number of Terminals 10Terminals
Type of heatsink extruded
Heatsink shape U
Colour aluminium
Material finishing transparently anodized
Mounting for back plate
Internal width 26.2mm
Gross weight 700 g
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer SEIKO EPSON CORP
Package Description , SOLCC10,.1,28
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material CERAMIC
Package Equivalence Code SOLCC10,.1,28
Reach Compliance Code unknown
Qualification Status Not Qualified
Power Supplies 1.5/5 V
Temperature Grade INDUSTRIAL
Time-Min SECONDS
2nd Connector Number of Positions Loaded LED
Interrupt Capability Y
Volatile NO
Information Access Method SERIAL, 2 WIRE/I2C
Length 1m
Width 53.9mm
Height 34.4mm
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RX8130CE Documents

Download datasheets and manufacturer documentation for   RX8130CE

RX8130CE brand manufacturers: Epson Electronics America Inc, Twicea stock, RX8130CE reference price.Epson Electronics America Inc. RX8130CE parameters, RX8130CE Datasheet PDF and pin diagram description download.You can use the RX8130CE Embedded - Microcontrollers - Application Specific, DSP Datesheet PDF, find RX8130CE pin diagram and circuit diagram and usage method of function,RX8130CE electronics tutorials.You can download from the Twicea.