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EPC2106ENGRT Tech Specifications

EPC  EPC2106ENGRT technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 16 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case Die
Supplier Device Package Die
Current - Continuous Drain (Id) @ 25℃ 1.7A
Operating Temperature -40°C~150°C TJ
Packaging Tape & Reel (TR)
Series eGaN®
Published 2015
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Max Operating Temperature 150°C
Min Operating Temperature -40°C
FET Type 2 N-Channel (Half Bridge)
Rds On (Max) @ Id, Vgs 70mOhm @ 2A, 5V
Vgs(th) (Max) @ Id 2.5V @ 600μA
Input Capacitance (Ciss) (Max) @ Vds 75pF @ 50V
Gate Charge (Qg) (Max) @ Vgs 0.73nC @ 5V
Drain to Source Voltage (Vdss) 100V
Continuous Drain Current (ID) 1.7A
Input Capacitance 75pF
FET Feature GaNFET (Gallium Nitride)
Rds On Max 70 mΩ
RoHS Status ROHS3 Compliant
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EPC2106ENGRT Documents

Download datasheets and manufacturer documentation for   EPC2106ENGRT

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