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857-031-558-104 Tech Specifications

EDAC  857-031-558-104 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Contact Plating Gold
Mounting Type Through Hole, Right Angle
Housing Material Polyphenylene Sulfide (PPS)
Material - Insulation Polyphenylene Sulfide (PPS)
RoHS Details
Mounting Styles Panel Mount
Contact Materials Copper Alloy
Maximum Operating Temperature + 125 C
Minimum Operating Temperature - 40 C
Factory Pack QuantityFactory Pack Quantity 1
Package Bulk
Base Product Number 857-031
Mfr EDAC Inc.
Product Status Active
Series 857
Operating Temperature -40°C ~ 125°C
Termination Solder
Number of Positions 31 PositionPosition
Color Black
Number of Rows 2 RowRow
Gender Female
Contact Type Semi Bellows
Pitch 3.96 mm
Current Rating 5 A
Contact Finish Gold
Termination Style Wire Wrap
Card Type Non Specified - Single Edge
Read Out Single
Insulation Resistance 5000 MOhms
Number of Positions/Bay/Row 31Positions/Bay/Rows
Flange Feature Flush Mount, Top Opening, Unthreaded, 0.156 (3.96mm) Dia
Product Receptacles
Mounting Angle Right Angle
Features -
Contact Finish Thickness 10.0µin (0.25µm)
Card Thickness 0.054 ~ 0.070 (1.37mm ~ 1.78mm)
Board Thickness 1.57 mm
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