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857-028-445-112 Tech Specifications
EDAC 857-028-445-112 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Contact Plating | Gold | |
| Mounting Type | Through Hole | |
| Housing Material | Polyphenylene Sulfide (PPS) | |
| Material - Insulation | Polyphenylene Sulfide (PPS) | |
| RoHS | Details | |
| Mounting Styles | Panel Mount | |
| Contact Materials | Copper Alloy | |
| Maximum Operating Temperature | + 125 C | |
| Minimum Operating Temperature | - 40 C | |
| Factory Pack QuantityFactory Pack Quantity | 1 | |
| Package | Bulk | |
| Base Product Number | 857-028 | |
| Mfr | EDAC Inc. | |
| Product Status | Active | |
| Series | 857 | |
| Operating Temperature | -40°C ~ 125°C | |
| Termination | Wire Wrap | |
| Number of Positions | 28 PositionPosition | |
| Color | Black | |
| Number of Rows | 2 RowRow | |
| Gender | Female | |
| Contact Type | Semi Bellows | |
| Pitch | 3.96 mm | |
| Current Rating | 5 A | |
| Contact Finish | Tin | |
| Termination Style | Wire Wrap | |
| Card Type | Non Specified - Single Edge | |
| Read Out | Single | |
| Insulation Resistance | 5000 MOhms | |
| Number of Positions/Bay/Row | 28Positions/Bay/Rows | |
| Flange Feature | Side Mount Opening, Unthreaded, 0.128 (3.25mm) Dia | |
| Product | Receptacles | |
| Mounting Angle | Vertical | |
| Features | - | |
| Contact Finish Thickness | - | |
| Card Thickness | 0.054 ~ 0.070 (1.37mm ~ 1.78mm) | |
| Board Thickness | 1.57 mm |
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