338-020-541-278 Tech Specifications

EDAC  338-020-541-278 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Contact Plating Gold
Mounting Type Through Hole
Material - Insulation Diallyl Phthalate (DAP)
RoHS Details
Factory Pack QuantityFactory Pack Quantity 1
Package Bulk
Base Product Number 338-020
Mfr EDAC Inc.
Product Status Active
Contact Materials Copper Alloy
Series 338
Operating Temperature -65°C ~ 125°C
Termination Wire Wrap
Number of Positions 20 PositionPosition
Color Green
Number of Rows 2Rows
Gender Female
Contact Type Cantilever
Pitch 3.96 mm
Contact Finish Gold
Card Type Non Specified - Dual Edge
Read Out Dual
Number of Positions/Bay/Row 10Positions/Bay/Rows
Flange Feature Flush Mount, Top Opening, Threaded Insert, 4-40
Mounting Angle Vertical
Features Card Guides
Contact Finish Thickness 10.0µin (0.25µm)
Card Thickness 0.054 ~ 0.070 (1.37mm ~ 1.78mm)
Board Thickness 1.57 mm
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