Twicea electronic parts stores,electronic components,electronic parts,electronics parts supply Twicea electronic parts stores,electronic components,electronic parts,electronics parts supply

895-007-524-608 Tech Specifications

EDAC  895-007-524-608 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Through Hole
Contact Plating Gold
Housing Material Polyphenylene Sulfide (PPS)
Material - Insulation Polyphenylene Sulfide (PPS)
Package Bulk
Base Product Number 895-007
Mfr EDAC Inc.
Product Status Active
Contact Materials Copper Alloy
Mounting Styles Panel Mount
Operating Temperature -40°C ~ 125°C
Series 895
Termination Solder
Number of Positions 7Positions
Color Black
Number of Rows 1Row
Gender Female
Contact Type Cantilever
Pitch 0.100 (2.54mm)
Contact Finish Gold
Card Type Non Specified - Single Edge
Read Out Single
Number of Positions/Bay/Row 7Positions/Bay/Rows
Flange Feature Top Mount Opening, Threaded Insert, 4-40
Product Receptacles
Mounting Angle Vertical
Features -
Contact Finish Thickness 10.0µin (0.25µm)
Card Thickness 0.054 ~ 0.070 (1.37mm ~ 1.78mm)
Board Thickness 1.57 mm
View Similar
895-007-524-608 brand manufacturers: EDAC, Twicea stock, 895-007-524-608 reference price.EDAC. 895-007-524-608 parameters, 895-007-524-608 Datasheet PDF and pin diagram description download.You can use the 895-007-524-608 Card Edge Connectors - Edgeboard Connectors, DSP Datesheet PDF, find 895-007-524-608 pin diagram and circuit diagram and usage method of function,895-007-524-608 electronics tutorials.You can download from the Twicea.