Dynex Semiconductor SP8690A Signal Switches
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SP8690A Tech Specifications
Taiwan Semiconductor SP8690A technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Surface Mount | NO | |
| Material | synthetic polyolefin | |
| Number of Terminals | 16Terminals | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | GEC PLESSEY SEMICONDUCTORS | |
| Package Description | DIP, DIP16,.3 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Body Material | CERAMIC | |
| Package Code | DIP | |
| Package Equivalence Code | DIP16,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Diameter of protected wire (cable) | 12.8…24 mm | |
| Diameter before shrink | 26.0 mm | |
| Diameter after shrink | 12.5 mm | |
| Wall thickness before shrink | 0.55 mm | |
| Wall thickness after shrink | 0.9 mm | |
| Gross weight | 1725.00 | |
| Transport packaging size/quantity | 46*46*24/10 | |
| Packaging | coil 50 m | |
| JESD-609 Code | e0 | |
| Type | Heat shrink tube without adhesive | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Color | blue | |
| HTS Code | 8542.39.00.01 | |
| Terminal Position | DUAL | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Reach Compliance Code | unknown | |
| JESD-30 Code | R-XDIP-T16 | |
| Qualification Status | Not Qualified | |
| Temperature Grade | MILITARY | |
| Operating temperature range | -55…+125 °C | |
| Logic IC Type | PRESCALER | |
| Power Supply Current-Max (ICC) | 21 mA | |
| Shrink temperature | +70…+120 °C | |
| Max Frequency@Nom-Sup | 200000000 Hz | |
| Operating voltage | 600 V | |
| Shrink Ratio | 2:1 |
SP8690A Documents
Download datasheets and manufacturer documentation for SP8690A
- Datasheets7df484da8a2e852d60aea24bbba628bf.pdf
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