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ZXMC10A816N8TC Tech Specifications

Diodes  ZXMC10A816N8TC technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 17 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 8-SOIC (0.154, 3.90mm Width)
Number of Pins 8Pins
Weight 73.992255mg
Transistor Element Material SILICON
Number of Elements 2 Elements
Turn Off Delay Time 20 ns
Operating Temperature -55°C~150°C TJ
Packaging Tape & Reel (TR)
Published 2005
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8Terminations
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
Max Power Dissipation 1.8W
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40
Pin Count 8
Operating Mode ENHANCEMENT MODE
Power Dissipation 2.1W
Turn On Delay Time 4.3 ns
FET Type N and P-Channel
Transistor Application SWITCHING
Rds On (Max) @ Id, Vgs 230m Ω @ 1A, 10V
Vgs(th) (Max) @ Id 2.4V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 497pF @ 50V
Gate Charge (Qg) (Max) @ Vgs 9.2nC @ 10V
Rise Time 5.2ns
Drain to Source Voltage (Vdss) 100V
Polarity/Channel Type N-CHANNEL AND P-CHANNEL
Fall Time (Typ) 12 ns
Continuous Drain Current (ID) 2A
Gate to Source Voltage (Vgs) 20V
Drain Current-Max (Abs) (ID) 1.7A
Drain to Source Breakdown Voltage 100V
Pulsed Drain Current-Max (IDM) 9.4A
FET Technology METAL-OXIDE SEMICONDUCTOR
FET Feature Logic Level Gate
Height 1.5mm
Length 4.95mm
Width 3.95mm
REACH SVHC No SVHC
Radiation Hardening No
RoHS Status ROHS3 Compliant
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