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BZX84C12-7-F Tech Specifications

Diodes  BZX84C12-7-F technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 19 Weeks
Contact Plating Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case TO-236-3, SC-59, SOT-23-3
Number of Pins 3Pins
Weight 7.994566mg
Diode Element Material SILICON
Number of Elements 1 Element
Operating Temperature -65°C~150°C
Packaging Tape & Reel (TR)
Published 2008
Tolerance ±5%
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 3Terminations
Termination SMD/SMT
ECCN Code EAR99
Additional Feature HIGH RELIABILITY
HTS Code 8541.10.00.50
Power Rating 350mW
Voltage - Rated DC 12V
Max Power Dissipation 350mW
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number BZX84C12
Pin Count 3
Working Voltage 12V
Polarity UNIDIRECTIONAL
Impedance 25Ohm
Element Configuration Single
Diode Type ZENER DIODE
Current - Reverse Leakage @ Vr 100nA @ 8V
Power Dissipation 350mW
Output Current 28mA
Voltage - Forward (Vf) (Max) @ If 900mV @ 10mA
Power - Max 300mW
Max Reverse Leakage Current 100nA
Impedance-Max 25Ohm
Test Current 5mA
Reference Voltage 12V
Forward Voltage 900mV
Zener Voltage 12V
Peak Reverse Current 100nA
Voltage Tolerance 5%
Reverse Voltage 8V
ESD Protection No
Zener Current 5mA
Max Junction Temperature (Tj) 150°C
Height 1.1mm
Length 2.9mm
Width 1.3mm
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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BZX84C12-7-F Documents

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