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B3100-13-F Tech Specifications

Diodes  B3100-13-F technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 19 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case DO-214AB, SMC
Number of Pins 2Pins
Weight 210.013267mg
Diode Element Material SILICON
Number of Elements 1 Element
Packaging Tape & Reel (TR)
Published 2010
JESD-609 Code e3
Pbfree Code no
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2Terminations
Termination SMD/SMT
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
Max Operating Temperature 125°C
Min Operating Temperature -55°C
Applications EFFICIENCY
Additional Feature LOW POWER LOSS
HTS Code 8541.10.00.80
Capacitance 100pF
Voltage - Rated DC 100V
Terminal Position DUAL
Terminal Form C BEND
Peak Reflow Temperature (Cel) 260
Current Rating 3A
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number B3100
Pin Count 2
Polarity Standard
Voltage 100V
Element Configuration Single
Speed Fast Recovery =< 500ns, > 200mA (Io)
Current 3A
Diode Type Schottky
Current - Reverse Leakage @ Vr 500μA @ 100V
Output Current 3A
Voltage - Forward (Vf) (Max) @ If 790mV @ 3A
Forward Current 3A
Operating Temperature - Junction -55°C~125°C
Forward Voltage 790mV
Max Reverse Voltage (DC) 100V
Average Rectified Current 3A
Number of Phases 1Phase
Peak Reverse Current 500μA
Max Repetitive Reverse Voltage (Vrrm) 100V
Capacitance @ Vr, F 100pF @ 4V 1MHz
Peak Non-Repetitive Surge Current 100A
Reverse Voltage 100V
Max Forward Surge Current (Ifsm) 100A
Max Junction Temperature (Tj) 125°C
Height 2.5mm
Length 7.11mm
Width 6.22mm
REACH SVHC No SVHC
Radiation Hardening No
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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B3100-13-F Documents

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