DG250-7.0 reverse pin pattern-02P Tech Specifications

DEGSON  DG250-7.0 reverse pin pattern-02P technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Conductor cross section solid 0.2~1.5mm²
Environmental items Compliant with REACH/RoHS
Contact Materials Copper alloy
Contact point metal surface tin-plated
Insulation Materials PA66
Insulating material group
Test Specification IEC60947/UL1059
Ambient temperature (operation) -40℃~105℃
Pluggable or not no
Number of potentials 2potentials
Pin arrangement Double-row of misalignment
Type of installation PCB welding
Connection direction 45°
Rated surge voltage(II/2) 6KV
Rated surge voltage(III/2) 6KV
Rated surge voltage(III/3) 6KV
Rated current(II/2) 1000V
Rated current(III/2) 630V
Rated current(III/3) 500V
Rated current (C) 8A
Rated current (D) 8A
Rated current (B) 8A
Rated voltage (D) 600V
Rated voltage (C) 300V
Rated voltage (B) 300V
Strip length 9mm
AWG 22~18AWG
Conductor cross section flexible 0.2~1.5mm²
Number of rows 1row
Pitch 7mm
Rated current 10A
Connection method Push-in spring connection
Rated voltage 630V
Process Wave soldering/manual soldering
Flammability rating UL94V-0
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DG250-7.0 reverse pin pattern-02P Documents

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