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- DG250-7.0 reverse pin pattern-02P
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DG250-7.0 reverse pin pattern-02P Tech Specifications
DEGSON DG250-7.0 reverse pin pattern-02P technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Conductor cross section solid | 0.2~1.5mm² | |
| Environmental items | Compliant with REACH/RoHS | |
| Contact Materials | Copper alloy | |
| Contact point metal surface | tin-plated | |
| Insulation Materials | PA66 | |
| Insulating material group | Ⅰ | |
| Test Specification | IEC60947/UL1059 | |
| Ambient temperature (operation) | -40℃~105℃ | |
| Pluggable or not | no | |
| Number of potentials | 2potentials | |
| Pin arrangement | Double-row of misalignment | |
| Type of installation | PCB welding | |
| Connection direction | 45° | |
| Rated surge voltage(II/2) | 6KV | |
| Rated surge voltage(III/2) | 6KV | |
| Rated surge voltage(III/3) | 6KV | |
| Rated current(II/2) | 1000V | |
| Rated current(III/2) | 630V | |
| Rated current(III/3) | 500V | |
| Rated current (C) | 8A | |
| Rated current (D) | 8A | |
| Rated current (B) | 8A | |
| Rated voltage (D) | 600V | |
| Rated voltage (C) | 300V | |
| Rated voltage (B) | 300V | |
| Strip length | 9mm | |
| AWG | 22~18AWG | |
| Conductor cross section flexible | 0.2~1.5mm² | |
| Number of rows | 1row | |
| Pitch | 7mm | |
| Rated current | 10A | |
| Connection method | Push-in spring connection | |
| Rated voltage | 630V | |
| Process | Wave soldering/manual soldering | |
| Flammability rating | UL94V-0 |
DG250-7.0 reverse pin pattern-02P Documents
Download datasheets and manufacturer documentation for DG250-7.0 reverse pin pattern-02P
- DatasheetsDG250-7.0-XXP-1Y-01A(H).T1-l.pdf
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