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- S29GL032N90TFI040
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S29GL032N90TFI040 Tech Specifications
Cypress S29GL032N90TFI040 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 14 Weeks | |
| Contact Plating | Tin | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | 48-TFSOP (0.724, 18.40mm Width) | |
| Number of Pins | 48Pins | |
| Memory Types | Non-Volatile | |
| Operating Temperature | -40°C~85°C TA | |
| Packaging | Tray | |
| Series | GL-N | |
| Published | 2008 | |
| JESD-609 Code | e3 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Number of Terminations | 48Terminations | |
| HTS Code | 8542.32.00.51 | |
| Voltage - Supply | 2.7V~3.6V | |
| Terminal Position | DUAL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Number of Functions | 1Function | |
| Supply Voltage | 3V | |
| Terminal Pitch | 0.5mm | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Supply Voltage-Max (Vsup) | 3.6V | |
| Power Supplies | 3/3.3V | |
| Supply Voltage-Min (Vsup) | 2.7V | |
| Memory Size | 32Mb 4M x 8 2M x 16 | |
| Nominal Supply Current | 50mA | |
| Memory Format | FLASH | |
| Memory Interface | Parallel | |
| Data Bus Width | 16b | |
| Organization | 2MX16 | |
| Write Cycle Time - Word, Page | 90ns | |
| Density | 32 Mb | |
| Standby Current-Max | 0.000005A | |
| Access Time (Max) | 90 ns | |
| Sync/Async | Asynchronous | |
| Programming Voltage | 3V | |
| Data Polling | YES | |
| Toggle Bit | YES | |
| Command User Interface | YES | |
| Number of Sectors/Size | 863Sectors/Sizes | |
| Sector Size | 8K64K | |
| Page Size | 8/16words | |
| Ready/Busy | YES | |
| Boot Block | BOTTOM | |
| Common Flash Interface | YES | |
| Height | 1.05mm | |
| Length | 18.5mm | |
| Width | 12.1mm | |
| REACH SVHC | No SVHC | |
| Radiation Hardening | No | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
S29GL032N90TFI040 Documents
Download datasheets and manufacturer documentation for S29GL032N90TFI040
- Environmental InformationRoHS3 Certificate
- PCN Design/SpecificationMold/Die Epoxy Alt 21/Oct/2015 Mold/Die Epoxy Addition 14/Dec/2015
- PCN PackagingDate Code/Shelf Life Chgs 18/Jul/2019 Mult Devices 19/Jul/2017
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