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- CYPD2105-20FNXIT
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CYPD2105-20FNXIT Tech Specifications
Cypress CYPD2105-20FNXIT technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 15 Weeks | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | 20-UFBGA, WLCSP | |
| Number of Pins | 20Pins | |
| Memory Types | FLASH | |
| Number of I/Os | 9I/Os | |
| Operating Temperature | -40°C~85°C TA | |
| Packaging | Tape & Reel (TR) | |
| Series | EZ-PD™ CCG2 | |
| Published | 2011 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 20Terminations | |
| Applications | USB Type C | |
| HTS Code | 8542.31.00.01 | |
| Voltage - Supply | 1.71V~5.5V | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Supply Voltage | 3.3V | |
| Terminal Pitch | 0.4mm | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Interface | I2C, SPI, UART/USART, USB | |
| RAM Size | 4K x 8 | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Core Processor | ARM® Cortex®-M0 | |
| Program Memory Type | FLASH (32KB) | |
| Core Architecture | ARM | |
| Length | 2.03mm | |
| Height Seated (Max) | 0.55mm | |
| Width | 1.63mm | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
CYPD2105-20FNXIT Documents
Download datasheets and manufacturer documentation for CYPD2105-20FNXIT
- DatasheetsCYPD2105-20FNXIT-Cypress-Semiconductor-datasheet-44444868.pdf EZ-PD? CCG2 Overview
- PCN Assembly/OriginFab Site 26/Dec/2016
- Environmental InformationRoHS3 Certificate
- PCN Obsolescence/ EOLCS7331P-CAZR 02/Jul/2019
- PCN PackagingDate Code/Shelf Life Chgs 18/Jul/2019 Mult Devices 19/Jul/2017
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