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- CY8C4248LQI-BL583
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CY8C4248LQI-BL583 Tech Specifications
Cypress CY8C4248LQI-BL583 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 22 Weeks | |
| Mounting Type | Surface Mount | |
| Package / Case | 56-UFQFN Exposed Pad | |
| Surface Mount | YES | |
| Data Converters | A/D 16x12b SAR; D/A 2xIDAC | |
| Number of I/Os | 36I/Os | |
| Operating Temperature | -40°C~85°C TA | |
| Packaging | Tray | |
| Series | PSOC® 4 CY8C4xx8 BLE | |
| Published | 2004 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Number of Terminations | 56Terminations | |
| Terminal Position | QUAD | |
| Terminal Form | NO LEAD | |
| Supply Voltage | 3.3V | |
| Frequency | 2.482GHz | |
| JESD-30 Code | S-XQCC-N56 | |
| Supply Voltage-Max (Vsup) | 5.5V | |
| Interface | I2C, IrDA, SPI, UART, USART | |
| Memory Size | 256kB | |
| Oscillator Type | Internal | |
| RAM Size | 32K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 1.71V~5.5V | |
| uPs/uCs/Peripheral ICs Type | MULTIFUNCTION PERIPHERAL | |
| Core Processor | ARM® Cortex®-M0 | |
| Peripherals | Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT | |
| Program Memory Type | FLASH | |
| Core Size | 32-Bit | |
| Program Memory Size | 256KB 256K x 8 | |
| Connectivity | I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | |
| Data Rate | 1 Mbps | |
| Data Bus Width | 32b | |
| Number of Timers/Counters | 4Timers/Counters | |
| Boundary Scan | NO | |
| Number of A/D Converters | 1A/D Converter | |
| Max Junction Temperature (Tj) | 125°C | |
| Number of I2C Channels | 2I2C Channels | |
| Ambient Temperature Range High | 105°C | |
| Height | 600μm | |
| Length | 7mm | |
| RoHS Status | ROHS3 Compliant |
CY8C4248LQI-BL583 Documents
Download datasheets and manufacturer documentation for CY8C4248LQI-BL583
- DatasheetsPSoC 4XX8 BLE 4.2 CY8C4248LQI-BL583-Cypress-Semiconductor-datasheet-78939790.pdf
- PCN Design/SpecificationMult Dev Material Chg 16/Oct/2019
- PCN Assembly/OriginMult Devices Fab Site 15/Mar/2018
- Environmental InformationRoHS3 Certificate
- PCN PackagingDate Code/Shelf Life Chgs 18/Jul/2019
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